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GS8160F18/32/36BT-5.5/6.5/7.5
100-Pin TQFP Commercial Temp Industrial Temp Features
* Flow Through mode operation; Pin 14 = No Connect * 2.5 V or 3.3 V +10%/-10% core power supply * 2.5 V or 3.3 V I/O supply * LBO pin for Linear or Interleaved Burst mode * Internal input resistors on mode pins allow floating mode pins * Byte Write (BW) and/or Global Write (GW) operation * Internal self-timed write cycle * Automatic power-down for portable applications * JEDEC-standard 100-lead TQFP package * RoHS-compliant 100-lead TQFP package available
1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs
5.5 ns-8.5 ns 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O
interleave order with the Linear Burst Order (LBO) input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance. Designing For Compatibility The JEDEC standard for Burst RAMS calls for a FT mode pin option on Pin 14. Board sites for flow through Burst RAMS should be designed with VSS connected to the FT pin location to ensure the broadest access to multiple vendor sources. Boards designed with FT pin pads tied low may be stuffed with GSI's pipeline/flow through-configurable Burst RAMs or any vendor's flow through or configurable Burst SRAM. Boards designed with the FT pin location tied high or floating must employ a non-configurable flow through Burst RAM, like this RAM, to achieve flow through functionality. Byte Write and Global Write Byte write operation is performed by using Byte Write enable (BW) input combined with one or more individual byte write signals (Bx). In addition, Global Write (GW) is available for writing all bytes at one time, regardless of the Byte Write control inputs. Sleep Mode Low power (Sleep mode) is attained through the assertion (High) of the ZZ signal, or by stopping the clock (CK). Memory data is retained during Sleep mode. Core and Interface Voltages The GS8160F18/32/36BT operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V and 2.5 V compatible. Separate output power (VDDQ) pins are used to decouple output noise from the internal circuits and are 3.3 V and 2.5 V compatible.
Functional Description
Applications The GS8160F18/32/36BT is an 18,874,368-bit (16,777,216-bit for x32 version) high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support. Controls Addresses, data I/Os, chip enables (E1, E2, E3), address burst control inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW, GW) are synchronous and are controlled by a positive-edge-triggered clock input (CK). Output enable (G) and power down control (ZZ) are asynchronous inputs. Burst cycles can be initiated with either ADSP or ADSC inputs. In Burst mode, subsequent burst addresses are generated internally and are controlled by ADV. The burst address counter may be configured to count in either linear or
Parameter Synopsis
-5.5
Flow Through 2-1-1-1 tKQ tCycle Curr (x18) Curr (x32/x36) 5.5 5.5 225 255
-6.5
6.5 6.5 200 220
-7.5
7.5 7.5 185 205
Unit
ns ns mA mA
Rev: 1.03 9/2005
1/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
GS8160F18B 100-Pin TQFP Pinout
VDDQ VSS NC NC DQB DQB VSS VDDQ DQB DQB NC VDD NC VSS DQB DQB VDDQ VSS DQB DQB DQPB NC VSS VDDQ NC NC NC
NC NC NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 1M x 18 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 NC NC BB BA E3 VDD VSS CK GW BW G ADSC ADSP ADV A A
A NC NC VDDQ VSS NC DQPA DQA DQA VSS VDDQ DQA DQA VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA NC NC VSS VDDQ NC NC NC
Rev: 1.03 9/2005
LBO A A A A A1 A0 NC NC VSS VDD A A A A A A A A A 2/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
GS8160F32B 100-Pin TQFP Pinout
NC DQC DQC VDDQ VSS DQC DQC DQC DQC VSS VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS VDDQ DQD DQD NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 512K x 32 10 71 11 Top View 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 BD BC BB BA E3 VDD VSS CK GW BW G ADSC ADSP ADV A A
NC DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA NC
LBO A A A A A1 A0 NC NC VSS VDD A A A A A A A A Rev: 1.03 9/2005 3/22
A
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
GS8160F36B 100-Pin TQFP Pinout
DQPC DQC DQC VDDQ VSS DQC DQC DQC DQC VSS VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSS DQD DQD DQD DQD VSS VDDQ DQD DQD DQPD
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 512K x 36 10 71 11 Top View 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 BD BC BB BA E3 VDD VSS CK GW BW G ADSC ADSP ADV A A
DQPB DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA DQPA
LBO A A A A A1 A0 NC NC VSS VDD A A A A A A A A Rev: 1.03 9/2005 4/22
A
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
TQFP Pin Description Symbol
A0, A1 A DQA DQB DQC DQD NC BW BA, BB, BC, BD CK GW E1, E3 E2 G ADV ADSP, ADSC ZZ LBO VDD VSS VDDQ
Type
I I
Description
Address field LSBs and Address Counter preset Inputs Address Inputs
I/O
Data Input and Output pins
-- I I I I I I I I I I I I I I
No Connect Byte Write--Writes all enabled bytes; active low Byte Write Enable for DQA, DQB Data I/Os; active low Clock Input Signal; active high Global Write Enable--Writes all bytes; active low Chip Enable; active low Chip Enable; active high Output Enable; active low Burst address counter advance enable; active low Address Strobe (Processor, Cache Controller); active low Sleep Mode control; active high Linear Burst Order mode; active low Core power supply I/O and Core Ground Output driver power supply
Rev: 1.03 9/2005
5/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
GS8160F18/32/36B Block Diagram
Register
A0-An
D
Q A0 D0 A1 Q0 D1 Q1 Counter Load A0 A1
A
LBO ADV CK ADSC ADSP GW BW BA
Register
Memory Array
Q D Q D
Register
D BB
Q
36 4
36
Register
D BC
Q Q
Register
D
Register
Q
Register
D
D BD
Q
Register
D
Q
E1 E2 E3
Register
D
Q
Register
D
Q
0 G Power Down Control
ZZ
1
DQx1-DQx9
Note: Only x36 version shown for simplicity.
Rev: 1.03 9/2005
6/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Mode Pin Functions Mode Name
Burst Order Control Power Down Control
Pin Name
LBO ZZ
State
L H L or NC H
Function
Linear Burst Interleaved Burst Active Standby, IDD = ISB
Note: Thereis a pull-down device on the ZZ pin, so this input pin can be unconnected and the chip will operate in the default states as specified in the above tables. Burst Counter Sequences
Linear Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0]
1st address 2nd address 3rd address 4th address 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10
Interleaved Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0]
1st address 2nd address 3rd address 4th address 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00
Note: The burst counter wraps to initial state on the 5th clock.
Note: The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 1.03 9/2005
7/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Byte Write Truth Table Function
Read Read Write byte a Write byte b Write byte c Write byte d Write all bytes Write all bytes
GW
H H H H H H H L
BW
H L L L L L L X
BA
X H L H H H L X
BB
X H H L H H L X
BC
X H H H L H L X
BD
X H H H H L L X
Notes
1 1 2, 3 2, 3 2, 3, 4 2, 3, 4 2, 3, 4
Notes: 1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs. 2. Byte Write Enable inputs BA, BB, BC, and/or BD may be used in any combination with BW to write single or multiple bytes. 3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs. 4. Bytes "C" and "D" are only available on the x32 and x36 versions.
Rev: 1.03 9/2005
8/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Synchronous Truth Table Operation
Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Read Cycle, Begin Burst Read Cycle, Begin Burst Write Cycle, Begin Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Write Cycle, Suspend Burst Write Cycle, Suspend Burst
Address Used
None None None External External External Next Next Next Next Current Current Current Current
State Diagram Key5
X X X R R W CR CR CW CW
E1
H L L L L L X H X H X H X H
E2
X F F T T T X X X X X X X X
ADSP ADSC
X L H L H H H X H X H X H X L X L X L L H H H H H H H H
ADV
X X X X X X L L L L H H H H
W3
X X X X F T F F T T F F T T
DQ4
High-Z High-Z High-Z Q Q D Q Q D D Q Q D D
Notes: 1. X = Don't Care, H = High, L = Low 2. E = T (True) if E2 = 1; E = F (False) if E2 = 0 3. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding 4. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown as "Q" in the Truth Table above). 5. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish basic synchronous or synchronous burst operations and may be avoided for simplicity. 6. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above. 7. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.03 9/2005
9/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Simplified State Diagram
X
Deselect W W Simple Synchronous Operation R R
X CW
First Write
R CR
First Read
X CR
Simple Burst Synchronous Operation
W R X Burst Write CR CW
R
Burst Read
X
CR
Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E1, E2, and E3) and Write (BA, BB, BC, BD, BW, and GW) control inputs and that ADSP is tied high and ADSC is tied low. 3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs and assumes ADSP is tied high and ADV is tied low.
Rev: 1.03 9/2005
10/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Simplified State Diagram with G
X
Deselect W W X W CW R R
First Write
R CR
First Read
X CR
CW
W X Burst Write R CR W CW
R X
Burst Read
CW
CR
Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G. 2. Use of "Dummy Reads" (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles. 3. Transitions shown in grey tone assume G has been pulsed high long enough to turn the RAM's drivers off and for incoming data to meet Data Input Set Up Time.
Rev: 1.03 9/2005
11/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
VDD VDDQ VI/O VIN IIN IOUT PD TSTG TBIAS
Description
Voltage on VDD Pins Voltage in VDDQ Pins Voltage on I/O Pins Voltage on Other Input Pins Input Current on Any Pin Output Current on Any I/O Pin Package Power Dissipation Storage Temperature Temperature Under Bias
Value
-0.5 to 4.6 -0.5 to 4.6 -0.5 to VDDQ +0.5 -0.5 to VDD +0.5 +/-20 +/-20 1.5 -55 to 125 -55 to 125
Unit
V V V V mA mA W
oC oC
Note: Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component.
Power Supply Voltage Ranges Parameter
3.3 V Supply Voltage 2.5 V Supply Voltage 3.3 V VDDQ I/O Supply Voltage 2.5 V VDDQ I/O Supply Voltage
Symbol
VDD3 VDD2 VDDQ3 VDDQ2
Min.
3.0 2.3 3.0 2.3
Typ.
3.3 2.5 3.3 2.5
Max.
3.6 2.7 3.6 2.7
Unit
V V V V
Notes
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+1.5 V maximum, with a pulse width not to exceed 50% tKC.
Rev: 1.03 9/2005
12/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
VDDQ3 Range Logic Levels Parameter
VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage
Symbol
VIH VIL VIHQ VILQ
Min.
2.0 -0.3 2.0 -0.3
Typ.
-- -- -- --
Max.
VDD + 0.3 0.8 VDDQ + 0.3 0.8
Unit
V V V V
Notes
1 1 1,3 1,3
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+1.5 V maximum, with a pulse width not to exceed 50% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
VDDQ2 Range Logic Levels Parameter
VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage
Symbol
VIH VIL VIHQ VILQ
Min.
0.6*VDD -0.3 0.6*VDD -0.3
Typ.
-- -- -- --
Max.
VDD + 0.3 0.3*VDD VDDQ + 0.3 0.3*VDD
Unit
V V V V
Notes
1 1 1,3 1,3
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+1.5 V maximum, with a pulse width not to exceed 50% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
Recommended Operating Temperatures Parameter
Ambient Temperature (Commercial Range Versions) Ambient Temperature (Industrial Range Versions)
Symbol
TA TA
Min.
0 -40
Typ.
25 25
Max.
70 85
Unit
C C
Notes
2 2
Notes: 1. The part numbers of Industrial Temperature Range versions end the character "I". Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be -2 V > Vi < VDDn+1.5 V maximum, with a pulse width not to exceed 50% tKC.
Rev: 1.03 9/2005
13/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Undershoot Measurement and Timing
VIH VDD +1.5 V VSS 50% VSS - 2.0 V 50% tKC VIL 50% VDD
Overshoot Measurement and Timing
50% tKC
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 2.5 V)
Parameter
Input Capacitance Input/Output Capacitance Note: These parameters are sample tested.
Symbol
CIN CI/O
Test conditions
VIN = 0 V VOUT = 0 V
Typ.
4 6
Max.
5 7
Unit
pF pF
AC Test Conditions Parameter
Input high level Input low level Input slew rate Input reference level Output reference level
Conditions
VDD - 0.2 V 0.2 V 1 V/ns VDD/2 VDDQ/2
Output load Fig. 1 Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Device is deselected as defined by the Truth Table.
Output Load 1 DQ 50 VDDQ/2 * Distributed Test Jig Capacitance 30pF*
Rev: 1.03 9/2005
14/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
DC Electrical Characteristics Parameter
Input Leakage Current (except mode pins) ZZ Input Current FT Input Current Output Leakage Current Output High Voltage Output High Voltage Output Low Voltage
Symbol
IIL IIN1 IIN2 IOL VOH2 VOH3 VOL
Test Conditions
VIN = 0 to VDD VDD VIN VIH 0 V VIN VIH VDD VIN VIL 0 V VIN VIL Output Disable, VOUT = 0 to VDD IOH = -8 mA, VDDQ = 2.375 V IOH = -8 mA, VDDQ = 3.135 V IOL = 8 mA
Min
-1 uA -1 uA -1 uA -100 uA -1 uA -1 uA 1.7 V 2.4 V --
Max
1 uA 1 uA 100 uA 1 uA 1 uA 1 uA -- -- 0.4 V
Rev: 1.03 9/2005
15/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Operating Currents
-5.5 Parameter Test Conditions Mode Symbol 0 to 70C
235 20 215 10 40
-6.5 -40 to 85C
245 20 225 10 50
-7.5 -40 to 85C
215 15 200 10 50
0 to 70C
205 15 190 10 40
0 to 70C
190 15 175 10 40
-40 to 85C
200 15 185 10 50
Unit
Operating Current Standby Current Deselect Current
Device Selected; All other inputs VIH or VIL Output open ZZ VDD - 0.2 V Device Deselected; All other inputs VIH or VIL
(x32/ x36) (x18) --
Flow Through Flow Through Flow Through
IDD IDDQ IDD IDDQ ISB IDD
mA mA mA
--
Flow Through
60
65
50
55
50
55
mA
Notes: 1. IDD and IDDQ apply to any combination of VDD3, VDD2, VDDQ3, and VDDQ2 operation. 2. All parameters listed are worst case scenario.
AC Electrical Characteristics
Parameter
Clock Cycle Time Clock to Output Valid Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock HIGH Time Clock LOW Time Clock to Output in High-Z G to Output Valid G to output in Low-Z G to output in High-Z ZZ setup time ZZ hold time ZZ recovery
Symbol
tKC tKQ tKQX tLZ tS tH tKH tKL tHZ1 tOE tOLZ1 tOHZ1 tZZS2 tZZH2 tZZR
1
-5.5
Min 5.5 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20 Max -- 5.5 -- -- -- -- -- -- 2.5 2.5 -- 2.5 -- -- -- Min 6.5 -- 3.0 3.0 1.5 0.5 1.3 1.5 1.5 -- 0 -- 5 1 20
-6.5
Max -- 6.5 -- -- -- -- -- -- 3.0 3.0 -- 3.0 -- -- -- Min 7.5 -- 3.0 3.0 1.5 0.5 1.5 1.7 1.5 -- 0 -- 5 1 20
-7.5
Max -- 7.5 -- -- -- -- -- -- 3.0 3.8 -- 3.8 -- -- --
Unit
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Flow Through
Notes: 1. These parameters are sampled and are not 100% tested. 2. ZZ is an asynchronous signal. However, In order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold times as specified above.
Rev: 1.03 9/2005
16/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Flow Through Mode Timing
Begin
Read A
Cont tKL tKH
Cont tKC
Write B
Read C
Read C+1 Read C+2 Read C+3 Read C
Cont
Deselect
CK ADSP tS tH ADSC tS tH ADV tS tH A0-An
A B C Fixed High
tS tH ADSC initiated read
tS tH GW tS tH BW tS tH Ba-Bd tS tH E1 tS tH E2 tS tH E3 G tH tS tOE DQa-DQd
Q(A) Deselected with E1
E2 and E3 only sampled with ADSC
tOHZ
D(B)
tKQ tLZ
Q(C) Q(C+1) Q(C+2) Q(C+3) Q(C)
tHZ tKQX
Rev: 1.03 9/2005
17/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after ZZ recovery time. Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode. When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing
tKH tKC CK Setup Hold ADSP ADSC tZZR tZZS ZZ tZZH tKL
Rev: 1.03 9/2005
18/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
TQFP Package Drawing (Package T) L Symbol
A1 A2 b c D D1 E E1 e L L1 Y
c Pin 1
Description
Standoff Body Thickness Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Length Coplanarity Lead Angle
Min. Nom. Max
0.05 1.35 0.20 0.09 21.9 19.9 15.9 13.9 -- 0.45 -- 0.10 1.40 0.30 -- 22.0 20.0 16.0 14.0 0.65 0.60 1.00 0.15 1.45 0.40 0.20 22.1 20.1 16.1 14.1 -- 0.75 -- 0.10
L1
e b
D D1
A1
Y
A2
0
--
7
E1 E
Notes: 1. All dimensions are in millimeters (mm). 2. Package width and length do not include mold protrusion.
Rev: 1.03 9/2005
19/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Ordering Information for GSI Synchronous Burst RAMs Org
1M x 18 1M x 18 1M x 18 512K x 32 512K x 32 512K x 32 512K x 36 512K x 36 512K x 36 1M x 18 1M x 18 1M x 18 512K x 32 512K x 32 512K x 32 512K x 36 512K x 36 512K x 36 1M x 18 1M x 18 1M x 18 512K x 32 512K x 32 512K x 32
Part Number1
GS8160F18BT-5.5 GS8160F18BT-6.5 GS8160F18BT-7.5 GS8160F32BT-5.5 GS8160F32BT-6.5 GS8160F32BT-7.5 GS8160F36BT-5.5 GS8160F36BT-6.5 GS8160F36BT-7.5 GS8160F18BT-5.5I GS8160F18BT-6.5I GS8160F18BT-7.5I GS8160F32BT-5.5I GS8160F32BT-6.5I GS8160F32BT-7.5I GS8160F36BT-5.5I GS8160F36BT-6.5I GS8160F36BT-7.5I GS8160F18BGT-5.5 GS8160F18BGT-6.5 GS8160F18BGT-7.5 GS8160F32BGT-5.5 GS8160F32BGT-6.5 GS8160F32BGT-7.5
Type
Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through
Package
TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP
Speed2 (MHz/ns)
5.5 6.5 7.5 5.5 6.5 7.5 5.5 6.5 7.5 5.5 6.5 7.5 5.5 6.5 7.5 5.5 6.5 7.5 5.5 6.5 7.5 5.5 6.5 7.5
TA3
C C C C C C C C C I I I I I I I I I C C C C C C
Status
MP MP MP MP MP MP MP MP MP MP MP MP MP MP MP MP MP MP PQ PQ PQ PQ PQ PQ
Notes: 1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. Example: GS8160F18B-6.5T. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. MP = Mass Production. PQ = Pre-Qualification. 5. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 9/2005
20/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
Ordering Information for GSI Synchronous Burst RAMs (Continued) Org
512K x 36 512K x 36 512K x 36 1M x 18 1M x 18 1M x 18 512K x 32 512K x 32 512K x 32 512K x 36 512K x 36 512K x 36
Part Number1
GS8160F36BGT-5.5 GS8160F36BGT-6.5 GS8160F36BGT-7.5 GS8160F18BGT-5.5I GS8160F18BGT-6.5I GS8160F18BGT-7.5I GS8160F32BGT-5.5I GS8160F32BGT-6.5I GS8160F32BGT-7.5I GS8160F36BGT-5.5I GS8160F36BGT-6.5I GS8160F36BGT-7.5I
Type
Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through Flow Through
Package
RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP RoHS-compliant TQFP
Speed2 (MHz/ns)
5.5 6.5 7.5 5.5 6.5 7.5 5.5 6.5 7.5 5.5 6.5 7.5
TA3
C C C I I I I I I I I I
Status
PQ PQ PQ PQ PQ PQ PQ PQ PQ PQ PQ PQ
Notes: 1. Customers requiring delivery in Tape and Reel should add the character "T" to the end of the part number. Example: GS8160F18B-6.5T. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. MP = Mass Production. PQ = Pre-Qualification. 5. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 9/2005
21/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS8160F18/32/36BT-5.5/6.5/7.5
18Mb Sync SRAM Datasheet Revision History
DS/DateRev. Code: Old; New GS8160FxxB_r1 8160FxxB_r1; 8160FxxB_r1_01 8160FxxB_r1_01; 8160FxxB_r1_02 8160FxxB_r1_01; 8160FxxB_r1_02 Content Content Content Types of Changes Format or Content Page;Revisions;Reason * Creation of new datasheet * Updated overshoot/undershoot information * Added 5.3 ns speed bin * Removed 5.3 ns speed bin * Added part status to Ordering Information table
Rev: 1.03 9/2005
22/22
(c) 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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